APPLIED MATERIALS, INTEL TO CO-DEVELOP NEXT-GEN AI CHIP TECHNOLOGY AMAT and INTC are expanding their R&D partnership to develop next-generation transistors, interconnects and advanced packaging for AI chips. The work will span Appliedā€™s new EPIC Center and Intelā€™s Oregon R&D campus, including development around Intelā€™s Foveros 3D stacking technology, with the goal of moving new AI-focused semiconductor technologies into high-volume manufacturing faster. 06-OCT-2026 09:04 AM ET