#Samsung – HBM4 Capacity Could At Least Double in 2027 Samsung Signals Major HBM4 Capacity Expansion Samsung Electronics is reportedly preparing to at least double its HBM4 and HBM4E production next year, as demand for advanced AI memory continues to grow. One of the key signals is the company’s planned increase in outsourced glass-carrier cleaning from around 20,000 units per month in 2026 to 50,000 per month in 2027. The requirement was only around 10,000 units per month in 2025. Glass carriers are used to support extremely thin DRAM wafers during the HBM manufacturing process. As HBM moves toward higher layer counts such as 12-layer and 16-layer designs, these processes become increasingly important. Samsung's total HBM production capacity is also expected to increase from roughly 180,000 wafers per month this year to around 250,000 next year, while the HBM4 family could account for approximately 80% of shipments, compared with about 40% this year. Samsung has already started mass production and commercial shipments of HBM4, while it began shipping 12-layer HBM4E samples to major customers earlier this year. Why It Matters The move shows Samsung is preparing for much stronger demand for next-generation memory used in AI accelerators and data centers. For the HBM market, the bigger story is not just higher production capacity. Samsung is trying to increase its share of the rapidly growing HBM4/HBM4E market as AI infrastructure continues to require more advanced memory.