SK ▲ +0.6% - Corgi SK hynix 2x Daily ETF $SK hynix is considering INTC Intel Foundry to produce base dies for HBM4E memory, reducing its reliance on $TSM TSMC for outsourced base-die production. The Details: • Foundry diversification: SK hynix may source HBM4E base dies from TSMC and Intel, creating a multi-vendor strategy for its next HBM generation. • Cost pressure: TSMC’s HBM4 base die reportedly costs three to four times more than stacked DRAM dies, which SK hynix makes internally. • Custom HBM: HBM4E requires customer-specific logic dies connecting memory stacks with GPUs and CPUs, raising the importance of advanced foundry capabilities. • Packaging option: SK hynix is evaluating Intel’s EMIB alongside TSMC’s CoWoS technologies for next-generation HBM integration. SK hynix is exploring the use of Intel's foundry services to produce base dies for its next-generation HBM4E memory chips, diversifying away from sole reliance on TSMC. The move addresses cost pressures associated with outsourced production and allows SK hynix to evaluate multiple foundry and packaging options for advanced memory integration, which supports the company's competitiveness in the high-margin HBM market. 31-AUG-2026 05:16 AM ET