SK hynix (KRX: 000660) and Sandisk (NASDAQ: SNDK) have introduced the industry's first High Bandwidth Flash (HBF) standard, designed to bridge the performance gap between High Bandwidth Memory (HBM) and traditional SSDs. SK hynix also unveiled its 375-layer 4D NAND technology, delivering 2.5x higher performance per watt, with mass production of 375-layer NAND-based enterprise SSDs (eSSDs) expected to begin early next year. Sector: Semiconductors / Memory Key Highlights 🤝 SK hynix and Sandisk introduced the first High Bandwidth Flash (HBF) standard ⚡ HBF is designed to bridge the gap between HBM and SSDs 💾 SK hynix unveiled 375-layer 4D NAND technology 🚀 Delivers 2.5x higher performance per watt 📅 Mass production of 375-layer NAND-based eSSDs planned for early next year Why It Matters The new HBF standard and next-generation NAND technology address growing AI storage demands by delivering faster, more power-efficient memory solutions for AI servers and high-performance computing workloads. Read More: https://www.thinksabio.com/reports/isr/SKHY